When you ordered, please note the following, with reference to specific models, specifications directory choice, according to the order processing to provide detailed information in order to work in between, To do this, you will be the most expeditious and satisfactory service.


1. The number of 2. Radiator Model 3. Crystal 4-hole pattern. The method of surface treatment 5. Welcome to the radiator section of the order attached note

Description:

1. Factory radiator to provide you with profiles of the entire length of 22mm is established several times, if you to plan the special requirements of processing;
2. The surface of the way to deal with a black oxide surface treatment H said that the surface of silver treatment Y said.

Radiator Notes:

1. In power semiconductor devices to ensure that the work of the actual junction temperature is less than the maximum junction temperature conditions should be chosen small size, light weight specifications.
2. Heat sink effect of the pros and installation process is closely related to the installation of power devices should be increased as much as possible the contact area with the heat sink to reduce thermal contact resistance and enhance heat transfer effects.
3. If the contact resistance of a smaller drop more in the power device installed between the radiator and the thermal conductivity of a thin Silicone Grease, can reduce the thermal resistance of 25 ~ 30%.
4. The need to install the device between the pad and the heat sink or thermal insulation pads, it is recommended the use of low resistance materials such as platinum copper, aluminum or platinum thin mica, polyester film.
5. When the installation of a device, the mounting hole (or group of holes) placed in the center of heat sink base (L / 2) position. When the installation of two or more devices when mounting hole (or group of holes) located in the center line of the radiator base uniform (L/2n) position.
6. Fastening devices need to ensure consistent screw torque.
7. Power device and the radiator is installed, the appropriate re-radiator of the power devices and machining or plastic, or else they will cause stress to increase the contact resistance.
8. Single fin heat sink, suitable for external device (such as installed in the chassis external) for the natural air-cooled, that is conducive to power devices can reduce ventilation cooling machine temperature rise.
9. Natural cooling, heat sink so that the section should be parallel to the direction of the horizontal plane: a mandatory air-cooled, the air flow should be parallel to the direction of heat sink fins.